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Multibeam 與美國商務部簽署價值 1.4 億美元意向書

此意向書支援啟動一項策略計劃,為新一代節能異構晶片整合提供精細間距製程 此意向書支援啟動一項策略計劃,為新一代節能異構晶片整合提供精細間距製程

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