Applied Materials Unveils Deposition and Selective Etch Systems to Advance 3D Chip Scaling
Summary
SANTA CLARA, Calif., June 15, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today introduced two new chipmaking systems designed to solve an emerging challenge in leading-edge semiconductor manufacturing: achieving precision processing in increasingly deep and narrow 3D structures. The new deposition and etch systems help chip
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